Processing Technology of Ultra-Thin Quartz with Abrasives.

Ultra-thin silver films obtained by sequential quench-anneal processing

Ultra-High Density MEMS-Based Interconnect for Wafer-Level Ultra-Thin Die Stacking Technology

This work describes a novel smart three axis compliant (STAC) interconnect targeted to revolutionize chipto-chip and chip-to-board high-density three dimensional (3D) integration for ultra-thin Si dies (≤ 75 μm) at the wafer level. The STAC interconnect is a 3D-compliant interconnect which allows stacked ultra-thin chips to move or flex freely during operation with negligible stress imposed on ...

Deconvoluted Si 2p Photoelectron Spectra of Ultra thin SiO2 film with FitXPS method

The main impetus for our research is provided by the growing interest worldwide in ultra thin silicon dioxide on silicon based nano devices. The obvious need for better knowledge in the ultra thin gate silicon dioxides, is motivated both by interests in fundamental research and phenomenology as well as by interests in possible applications, which can be found with better fitting of experimental...

Thin films with ultra-low thermal expansion.

Ultra-low coefficient of thermal expansion (CTE) is an elusive property, and narrow temperature ranges of operation and poor mechanical properties limit the use of conventional materials with low CTE. We structured a periodic micro-array of bi-metallic cells to demonstrate ultra-low effective CTE with a wide temperature range. These engineered tunable CTE thin film can be applied to minimize th...

Ultra Thin Deployable Reflector Antennas

We have recently proposed a new concept for deployable reflectors consisting of a thin parabolic carbon-fibre-reinforced-plastic (CFRP) shell stiffened along the edge by an elastically collapsible stiffener. Here we show that a stiffener accounting for less than 10% of the total mass of the reflector increases the stiffness of the softest deformation mode of the deployed reflector by 48 times, ...